Printed circuit board



A signal line (17), an electric power pattern (18) and an earth layer (19) are formed in the substrate (13). An exterior via (27) and an interior via (28) are formed in the substrate (13). The exterior via (27) which is connected to the signal line (17) is used as the signal line, and the interior via (28) which is connected to the earth layer is used for earthing. The signal line in the printed circuit board can be connected to the exterior via and can not be interrupted by the earthing. The signal line can be expended in the printed circuit board with the pattern which is more complicate comparing with the conventional pattern. Besides, the impedance matching can be reliably established.




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Patent Citations (1)

    Publication numberPublication dateAssigneeTitle
    CN-1249121-AMarch 29, 2000西门子公司用于具有高频构件电气设备的、特别是用于移动无线电信设备的印刷电路板

NO-Patent Citations (3)

    JP平10-41630A 1998.02.13
    JP平4-62894A 1992.02.27
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