导热膏及使用该导热膏的电子装置

Heat-conductive cream and electronic device using same

Abstract

一种电子装置,包括一发热电子元件、一用于对该发热电子元件散热的散热元件及填充于该发热电子元件与散热元件之间的导热膏,该导热膏包括占5~15%质量百分比的基体,占50~90%质量百分比的填充于基体内的热导填充物,该基体为硅油,该硅油在25℃时的粘度为50~50,000cs,该热导填充物为平均粒径均为2~20μm的球形锡粉与记忆合金粉至少其中之一种,该热导填充物于导热膏使用受压时产生形变并相互接触。
A kind of electronic devise, including one generate heat electronic component, one heat dissipation component which is used to dissipate heat of the generate heat electronic component and the heat conduction which is filled between the generate heat electronic component and the heat dissipation component, the heat conduction includes the base which takes up 5-15% mass percentage, the heat conduction filler which takes up 50-90% mass percentage, the viscosity of the base body is 50-50,000cs at 25 deg.C , the heat conduction filler is at least one of sphere tin powder whose average grain diameter is 2-20 mum and the memory alloy powder.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (3)

    Publication numberPublication dateAssigneeTitle
    CN-1568542-AJanuary 19, 2005英特尔公司Thermal interface material and electronic assembly having such a thermal interface material
    CN-1626598-AJune 15, 2005信越化学工业株式会社Heat-dissipating silicone grease composition
    WO-02061764-A1August 08, 2002Honeywell International Inc.Materiaux d'interface thermique souples et reticulables

NO-Patent Citations (0)

    Title

Cited By (0)

    Publication numberPublication dateAssigneeTitle